VISITING RESEARCHER/ POST DOC
Dr. SANG EUN BAE
Post Doctorate Fellow
Phone No: 713-743-4786
Email:
sebae@mail.uh.edu
The length
scales of integrated circuit chip have been going down to nano
dimensions in the last decade. However because conventional processes in
manufactory are not effective for the atomic scales, the industries have
looked for new processes. Electrochemical approach is one of excellent
alternatives as the breakthrough. For example, the Damascene copper
electroplating process has replaced traditional vacuum-deposited
aluminum-based interconnects for on-chip metallization. Additionally in
order to draw nano size architectures on the chip, the excellent surface
quality should be acquired. Electrochemical etching of the surface is
one of good method to prepare a surface with atomic flatness as well. On
this view point, my scientific interests have been focused on
electrochemical deposition of metals and surface etching of silicon and
metals. I am also interested in studies of electrocatalysis and electron
transfer. These are of fundamental importance to many processes in
science and technology and directly applicable to the fabrication of
fuel cell, bio sensors, etc.
Curriculum Vitae
