Selected Publications

Refereed Publications in Archival Journals and Books

  1. Weiye Zhu, Shyam Sridhar, Lei Liu, Eduardo Hernandez, Vincent M. Donnelly, and Demetre J. Economou, "Photo-Assisted Etching of Silicon in Chlorine- and Bromine-Containing Plasmas",Journal of Applied Physics, 115, 203303, 2014

  2. V. M. Donnelly and A. Kornblit, "Plasma etching: Yesterday, today, and tomorrow", J. Vac. Sci. Technol. A 31, 050825, 2013

  3. Demetre J. Economou, "Tailored ion energy distributions on plasma electrodes," J. Vac. Sci. Technol. A, 31, 050823 [Invited paper commemorating the 60th Anniversary of the American Vacuum Society], 2013

  4. E. Karakas, V. M. Donnelly, and D. J. Economou, "Langmuir Probe and Optical Emission Spectroscopy of CH3F/O2 Inductively Coupled Plasmas," J. Appl. Phys., 113, 213301, 2013

  5. Erdinc Karakas, Vincent M. Donnelly and Demetre J. Economou, "Abrupt transitions in species number densities and plasma parameters in a CH3F/O2 inductively coupled plasma," Appl. Phys. Lett., 102, 034107, 2013

  6. H. Shin, W. Zhu, L. Liu, S. Sridhar, V. M. Donnelly, D. J. Economou, C. Lenox, and T. Lii, "Selective Etching of TiN over TaN and vice-versa in Chlorine-Containing Plasmas," J. Vac. Sci. Technol. A, 31, 031305, 2013

  7. Paola Diomede, Doosik Kim and Demetre J. Economou, "Particle-in-cell simulation of electron and ion energy distributions in dc/rf hybrid capacitively-coupled plasmas," AIChE J., 59(9), 3214. Special Issue of AIChE Journal in memory of Neal Amundson, 2013

  8. Zhuo Chen, John A. Mucha, Vincent M. Donnelly, and Demetre J. Economou, "Plasma Enhanced Layer-by-Layer Deposition and Nano-crystallization of Hydrogenated Amorphous Silicon Films," J. Vac. Sci. Technol. B, 31, 061209, 2013

  9. P. Diomede, D. J. Economou and V. M. Donnelly, "Rapid calculation of the ion energy distribution on a plasma electrode", Journal of Applied Physics, 111, 123306 [9 pages], 2012.

  10. P. Diomede, S. Longo, D. J. Economou and M. Capitelli, "Hybrid Simulation of a DC-Enhanced Radio Frequency Capacitive Discharge in Hydrogen," J. Phys. D: Appl. Phys., 45, 175204 [14 pages], 2012.

  11. H. Shin, W. Zhu,  D. J. Economou, and V. M. Donnelly, "Ion energy distributions, electron temperatures, and electron densities in Ar, Kr, and Xe pulsed discharges," J. Vac. Sci. Technol. A 30, 031304 (2012); http://dx.doi.org/10.1116/1.4705515 [5 pages].

  12. H. Shin, W. Zhu, V. M. Donnelly, and D. J. Economou, "Surprising importance of photo-assisted etching of silicon in chlorine-containing plasmas," J. Vac. Sci. Technol. A 30, 021306 (2012); http://dx.doi.org/10.1116/1.3681285 [10 pages].

  13. V. M. Donnelly, J. Guha, and L. Stafford, "Critical review: Plasma-surface reactions and the spinning wall method," J. Vac. Sci. Technol. A 29, 010801 (2011) http://dx.doi.org/10.1116/1.3517478 [25 pages].

  14. H. Shin, W. Zhu, L. Xu, D. J. Economou and V. M. Donnelly, “Control of ion energy distributions using a pulsed plasma with synchronous bias on a boundary electrode,” Plasma Sources Sci. Technol., 20, 055001 (2011); doi:10.1088/0963-0252/20/5/055001 [9 pages].

  15. P. Diomede, V. M. Donnelly and D. J. Economou, “Particle-in-Cell Simulation of Ion Energy Distributions on an Electrode by Applying Tailored Bias Waveforms in the Afterglow of a Pulsed Plasma,” J. Appl. Phys., 109, 083302 (2011) [7 pages].

  16. P. Diomede, M. Nikolaou and D. J. Economou, “Voltage Waveform to Achieve a Desired Ion Energy Distribution on a Substrate in Contact with Plasma,” Plasma Sources Sci. Technol., 20, 045011 (2011) [9 pages].

  17. Q. Li, Y.-K. Pu, M. A. Lieberman and D. J. Economou, “A Dynamic Model of Streamer Coupling for the Homogeneity of Glow-Like Dielectric Barrier Discharges at Near-Atmospheric Pressure,” Phys. Rev. E., 83, 046405 (2011) [7 pages].

  18. G. Belostotskiy, O. Tola, V. M. Donnelly, D. J. Economou, and N. Sadeghi, “Gas Temperature and Electron Density Profiles in an Argon DC Microdischarge Measured by Optical Emission Spectroscopy,” J. Appl. Phys. 107, 053305, 7 pages (2010).

  19. Z. Chen, V. M. Donnelly, D. J. Economou, L. Chen, M. Funk, and R. Sundararajan, “Measurement of electron temperatures and electron energy distribution functions in dual frequency capacitively-coupled CF4/O2 plasmas using trace rare gases-optical emission spectroscopy (TRG-OES),” J. Vac. Sci. Technol. A., 27, 1159 (2009).

  20. S. G. Belostotskiy, V. M. Donnelly, D. J. Economou, and N. Sadeghi, “Spatially Resolved Measurements of Argon Metastable (1s5) Density in a High Pressure Microdischarge Using Diode Laser Absorption Spectroscopy,” IEEE Trans. Plasma Sci., 37, 852-858 (2009).

  21. D. J. Economou, “Modeling and Simulation of Fast Neutral Beam Sources for Materials Processing,” Plasma Processes and Polymers, 6, 308-319 (2009).

  22. Lin Xu, Lee Chen, Merritt Funk, Alok Ranjan, Mike Hummel, Ron Bravenec, Radha Sundararajan, Demetre J. Economou, and Vincent M. Donnelly, “Diagnostics of ballistic electrons in a dc/rf hybrid capacitively coupled discharge,” Appl. Phys. Lett., 93, 261502 (2008).

  23. Sergey Belostotskiy, Vincent M. Donnelly, and Demetre J. Economou, “Influence of Gas Heating on High Pressure DC Microdischarge I-V Characteristics,” Plasma Sources Sci. Technol., 17, 045018, (2008).

  24. Sergey Belostotskiy, Rahul Khandelwal, Qiang Wang, Vincent M. Donnelly, Demetre J. Economou, and Nader Sadeghi, “Measurement of Electron Temperature and Density in an Argon Microdischarge by Laser Thomson Scattering,” Appl. Phys. Lett. 92, 221507 (2008).

  25. Lin Xu, Azeem Nasrullah, Zhiying Chen, Manish Jain, Demetre J. Economou, Paul Ruchhoeft, and Vincent M. Donnelly, “Etching of nanopatterns in silicon using nanopantography,” Appl Phys. Lett., 92, 013124 (2008).

  26. D. J. Economou, “Fast (10s -100s eV) Neutral Beams for Materials Processing,” J. Phys. D: Appl. Phys., 41, 024001 (11 pages), (2008).

  27. “Mass and Auger Electron Spectroscopy Studies of the Interactions of Atomic and Molecular Chlorine on a Plasma Reactor Wall” J. Guha, V. M. Donnelly and Y-K. Pu, J. Appl. Phys. 103, 013306 (2008).

  28. “Auger electron spectroscopy of surfaces during exposure to gaseous discharges”, J. Guha, Y-K. Pu, and V. M. Donnelly, J. Vac. Sci. Technol. A, 25, 347 (2007).

  29. “Optical absorption and emission spectroscopy studies of ammonia-containing plasmas”, S. J. Kang and V. M. Donnelly, Plasma Sources Sci. Technol. 16, 265 (2007).

  30.  “Etching of nanopatterns in silicon by nanopantography”, L. Xu, A. Nasrullah, Z. Chen, P. Ruchhoeft, D. J. Economou and V, M. Donnelly, Appl. Phys. Lett., submitted (2007).

  31. Sang Ki Nam, Demetre J. Economou and Vincent M. Donnelly, “Generation of Fast Neutral Beams by Ion Neutralization in High Aspect Ratio Holes: A Particle-in-Cell Simulation Study,” IEEE Trans. Plasma Sci., 35, 1370-1378 (2007).

  32. Q. Wang, F. Doll, V. M. Donnelly, D. J. Economou, N. Sadeghi, and G. Franz, “Experimental and Theoretical Study of the Effect of Gas Flow on Gas Temperature in an Atmospheric Pressure Microplasma,” J. Phys. D: Appl. Phys., 40, 4202-4211 (2007).

  33. D. Economou, “Fundamentals and Applications of Ion-Ion Plasmas,” Appl. Surf. Science, 253, 6672-6680 (2007).

  34. A. Ranjan, C. Helmbrecht, V. M. Donnelly, D. J. Economou, and G. Franz, “Effect of Surface Roughness on the Energy Distribution of Fast Neutrals and Residual Ions Extracted from a Neutral Beam Source,” J. Vac. Sci. Technol. B., 25, 258-263 (2007).

  35. L. Xu, N. Sadeghi, V. M. Donnelly, and D. J. Economou, “Nickel Atom and Ion Density in an Inductively Coupled Plasma with an Internal Coil,” J. Appl. Phys., 101, 013304 (2007).

  36. S. Belostotskyi, Q. Wang, V. M. Donnelly, D. J. Economou, and N. Sadeghi, “Three Dimensional Gas Temperature Measurements in Atmospheric Pressure Microdischarges Using Raman Scattering,” Appl. Phys. Lett., 89, 251503 (2007).

  37. S. K. Nam, D. J. Economou, and V. M. Donnelly, “Particle-in-Cell Simulation of Ion Beam Extraction from a Pulsed Plasma Through a Grid,” Plasma Sources Sci. Technol., 16, 90-96 (2007).

  38. S. K. Nam, D. J. Economou, and V. M. Donnelly, “Particle-in-Cell Simulation of Beam Extraction Through a Hole in Contact with Plasma,” J. Phys. D: Appl. Phys., 39, 3994-4000 (2006).

  39. A. Ranjan, V. M. Donnelly, and D. J. Economou, “Energy Distribution and Flux of fast Neutrals and Residual Ions Extracted from a neutral beam Source,” J. Vac Sci. Technol. A 24, 1839-1846 (2006).

  40. O Polomarov, C. Theodosiou, I. Kaganovich, B. Ramamurthi, and D. J. Economou, “Self-Consistent Modeling of Non-Local Inductively Coupled Plasmas,” IEEE Trans. Plasma Science, 34, 767-785 (2006).

  41. Q. Wang, D. J. Economou, and V. M. Donnelly, “Simulation of Direct Current Micro-Plasma Discharge in Helium at Atmospheric Pressure,” J. Appl. Phys., 100, 023301 (2006).

  42. “Effectiveness of dilute H2 plasmas in removing boron from Si after etching of HfO2 films in BCl3 plasmas”, C. Wang and V. M. Donnelly, J. Vac. Sci. Technol. A, 24 41 (2006).

  43. “Plasma-Surface Reactions at a Spinning Wall”, P. F. Kurunczi, J. Guha, and V. M. Donnelly, Phys. Rev. Lett. 96, 018306 (2006).

  44. “Evaluation of the Effectiveness of H2 Plasmas in Removing Boron from Si after Etching of HfO2 Films in BCl3 Plasmas”, C. Wang and V. M. Donnelly, J. Vac. Sci. Technol. B, 23, 547 (2005).

  45. “Recombination Reactions of Oxygen Atoms on an Anodized Aluminum Plasma Reactor Wall, Studied by a Spinning Wall Method”, P. F. Kurunczi, J. Guha and V. M. Donnelly, J. Phys. Chem. B, 109, 20989 (2005).

  46. L. Xu; S. C. Vemula; M. Jain, S. K. Nam; V. M. Donnelly; D. J. Economou; and P. Ruchhoeft, “Nanopantography: A New Method for Massively Parallel Nanopatterning over Large Areas,” Nano Lett.; 5; 2563-2568 (2005).

  47. S.G. Belostotsky, D.J. Economou, D.V. Lopaev, and T.V. Rakhimova, “Negative Ion Destruction by O(3P) Atoms and O2(a1∆g) Molecules in an Oxygen Plasma,” Plasma Sources Science and Technology, 14, 532-542 (2005).

  48. L. Xu, D. J. Economou, V. M. Donnelly and P. Ruchhoeft, “Extraction of a Nearly Monoenergetic Ion Beam from a Pulsed Plasma,” Appl. Phys. Lett., 87, 041502 (2005).

  49. O Polomarov, C. Theodosiou, I. Kaganovich, B. Ramamurthi, and D. J. Economou, “Effectiveness of electron-cyclotron and transmission resonance heating in inductively coupled plasmas,” Phys. Plasmas, 12, 104505 (2005).

  50. Q. Wang, I. Koleva, V. M. Donnelly, and D. J. Economou, “Spatially Resolved Diagnostics of a Direct Current Atmospheric Pressure Helium Micro-plasma,” J. Phys. D: Appl. Phys., 38, 1690-1697 (2005).

  51. S. Nam, V. M. Donnelly and D. J. Economou, “Particle-in-cell simulation of ion flow through a hole in contact with plasma,” IEEE Trans. Plasma Sci., 33, 232 (2005).

  52. D. Economou, “Electronegative Plasma Reactor Engineering,” in Gaseous Dielectrics X,” edited by L. Christophorou, J. Olthoff, and P. Vassiliou, p. 157-166, Springer (2004).

  53. S. K. Nam and D. J. Economou, “Two-Dimensional Simulation of a Miniaturized Inductively Coupled Plasma,” J. Appl. Phys., 95, 2272-2277 (2004).

  54. D. Kim and D. J. Economou, “Simulation of a Two-Dimensional Sheath over a Flat Insulator-Conductor Interface on a RF Biased Electrode in a High Density Plasma,” J. Appl. Phys., 95, 3311-3318 (2004).

  55. “Plasma Electron Temperatures and Electron Energy Distributions Measured by Trace Rare Gases Optical Emission Spectroscopy”, V. M. Donnelly, J. Phys. D.: Appl. Phys. 37, R217 (2004).

  56. “Investigation of Fluorocarbon Plasma Deposition from c-C4F8 for Use as Passivation During Deep Silicon Etching” C. B. Labelle, V. M. Donnelly, G. R. Bogart, R. L. Opila, and A. Kornblit, J. Vac. Sci. Technol. A, 22, 2500 (2004).

  57. D. Kim and D. J. Economou, “Plasma Molding over Deep Trenches and the Resulting Ion and Energetic Neutral Distributions,” J. Vac. Sci. Technol. B 21, 1248-1253 (2003).

  58. D. Kim and D. J. Economou, “Simulation of Plasma Molding over a Ring on a Flat Surface,” J. Appl. Phys., 94, 3740-3747 (2003).

  59. D. Kim and D. J. Economou, “Simulation of a Two-Dimensional Sheath over a Flat Wall with an Insulator-Conductor Interface Exposed to a High Density Plasma,” J. Appl. Phys., 94, 2852-2857 (2003).

  60. B. Ramamurthi, D. J. Economou, and I. Kaganovich, “Effect of Electron Energy Distribution Function on Power Deposition and Plasma Density in an Inductively Coupled Discharge at Very Low Pressures,” Plasma Sources Sci. Technol. 12, 302-312 (2003).

  61. B. Ramamurthi, D. J. Economou, and I. Kaganovich, “Effect of non-local electron conductivity on power absorption and plasma density profiles in low pressure inductively coupled discharges,” Plasma Sources Sci. Technol., 12, 170 (2003).

  62. D. Kim, D. J. Economou, J. R. Woodworth, P. A. Miller, R. J. Shul, I. C. Abraham, B. P. Aragon, and T. W. Hamilton, “Plasma Molding Over Surface Topography: Simulation and Measurement of Ion Fluxes, Energies and Angular Distributions Over Trenches in RF High Density Plasmas,” IEEE Trans. Plasma Sci., 31, 691-702 (2003).

  63. J. R. Woodworth, P. A. Miller, R. J. Shul, I. C. Abraham, B. P. Aragon, T. W. Hamilton, C. G. Willison, D. Kim, and D. J. Economou, “An experimental and theoretical study of ion distributions near 300-μm-tall steps on rf-biased wafers in high density plasmas,” J. Vac. Sci. Technol. A 21, 147-155 (2003).

  64. B. White, Q. Wang, D. J. Economou, P. J. Wolf, T. Jacobs, and J. Fourcher, “Neutral oxygen beam stripping of photoresist on porous ultra low-k materials,” in Proceedings of the IEEE International Interconnect Technology Conference, June 2-4, 2003 San Francisco, p. 153 (2003).

  65. D. Kim and D. J. Economou, “Multidimensional Plasma Sheaths and Resulting Ion/Fast Neutral Distributions at the Substrate Surface,” in Proceedings of the Seventh International Symposium on Sputtering and Plasma Processes,” ISSP 2003, pp. 55-62, June 11-13, 2003, Kanazawa, Ishikawa, Japan.

  66. B. Ramamurthi and D. J. Economou, “Pulsed Power Plasma Reactors: Two Dimensional Electropositive Discharge Simulation in a GEC Reference Cell,” Plasma Sources Science and Technology, 11, 324-332 (2002).

  67. D. Kim and D. J. Economou, “Plasma Molding over Surface Topography: Simulation of Ion Flow and Energy and Angular Distributions over Steps in RF High Density Plasmas,” IEEE Trans. Plasma Sci., 30(5), 2048-2058 (2002).

  68. Doosik Kim and Demetre J. Economou, “Plasma Molding over Surface Topography,” JSME International Journal, Series B, 45(1), 117-122 (2002).

  69. C.-K. Kim and D. J. Economou, “Plasma Molding over Surface Topography: Energy and Angular Distributions of Ions Extracted out of Large Holes,” J. Appl. Phys., 91, 2594-2603, (2002).

  70. D. Kim and D. J. Economou, “Energy and angular distributions of ions and neutrals extracted from a slot in contact with a high density plasma,” IEEE Trans. Plasma Sci., 30(1), 126 (2002).

  71. B. Ramamurthi and D. J. Economou, “Metastable argon density evolution in a pulsed ICP discharge,” IEEE Trans. Plasma Sci., 30(1), 152 (2002).

  72. B. Ramamurthi and D. J. Economou, “Two-Dimensional Pulsed-Plasma Simulation of a Chlorine Discharge,” J. Vac. Sci. Technol. A, 20, 467-478 (2002).

  73. V. Midha, B. Ramamurthi, and D. J. Economou, “Time Evolution of an Ion-Ion Plasma after the Application of a Direct Current Bias,” J. Appl. Phys., 91, 6282-6287 (2002).

  74. T. Panagopoulos, V. Midha, D. Kim and D. J. Economou, “Three-Dimensional Simulation of Inductively Coupled Plasma Reactors,” J. Appl. Phys., 91, 2687-2696 (2002).

  75. “Optical Plasma Emission Spectroscopy of Etching Plasmas Used in Si-based Semiconductor Processing”, Plasma Sources Sci. Technol. 11, A26 (2002).

  76. “Determination of Electron Temperature, Fluorine Concentration, and Gas Temperature in Fluorocarbon/Argon Plasmas Using Optical Emission Spectroscopy”, M. J. Schabel, V. M Donnelly, A. Kornblit, W. W. Tai, J. Vac. Sci. Technol. A, 20, 555 (2002).

  77. "Diagnostics of Inductively Coupled Chlorine Plasmas: Measurement of Electron and Total Positive Ion Densities", M. V. Malyshev and V. M Donnelly, J. Appl. Phys. 90, 1130 (2001).

  78. "Etching of High-K Dielectric Zr1-xAlxOy Films in Chlorine-Containing Plasmas", K. Pelhos, V.M. Donnelly, A. Kornblit, M.L. Green, R.B. Van Dover, L. Manchanda, Y. Hu, M. Morris, and E. Bower, J. Vac. Sci. Technol., A 19, 1361 (2001).

  79. "Optical Actinometry of Cl2, Cl, Cl+, and Ar+ Densities in Inductively Coupled Cl2-Ar Plasmas", N. C. M. Fuller, I. P. Herman, and V. M. Donnelly, J. Appl. Phys. 90 3182 (2001).

  80. I. D. Kaganovich, B. N. Ramamurthi, and D. J. Economou, “Spatiotemporal Dynamics of Charged Species in the Afterglow of Plasmas Containing Negative Ions,” Phys. Rev. E, 64, 036402, (2001).

  81. V. Midha and D. J. Economou, “Dynamics of an Ion-Ion Plasma under Radio Frequency Bias,” J. Appl. Phys., 90, 1102 (2001).

  82. * Badri Ramamurthi and Demetre J. Economou, “Two-Dimensional Simulation of Pulsed power Electronegative Plasmas,” in Proceedings of the Symposium Fundamental Gas-Phase and Surface Chemistry in Vapor-Phase Deposition II, and Process Control, Diagnostics and Modeling in Semiconductor Manufacturing IV, edited by M. T. Swihart, M. D. Allendorf and M. Meyyappan, The Electrochemical Society, vol. PV 2001-13, pp. 405-414 (2001).

  83. * Chang-Koo Kim and Demetre J. Economou, “Energy and Angular Distribution of Ions Extracted from a Large Hole in Contact with a High Density Plasma,” in Proceedings of the Symposium Fundamental Gas-Phase and Surface Chemistry in Vapor-Phase Deposition II, and Process Control, Diagnostics and Modeling in Semiconductor Manufacturing IV, edited by M. T. Swihart, M. D. Allendorf and M. Meyyappan, The Electrochemical Society, vol. PV 2001-13, pp. 308-315 (2001).

  84. B. Ramamurthi and D. J. Economou, "Two-dimensional simulation of a pulsed electronegative discharge," Journal de Physique (IV), 11(Pr3), 163-169 (2001).

  85. S. Panda, D. J. Economou, and L. Chen, “Anisotropic Etching of Polymer Thin Films by High Energy (100s of eV) Oxygen Atom Neutral Beams,” J. Vac. Sci. Technol., A19, 398-404 (2001).

  86. S. K. Kanakasabapathy, L. J. Overzet, V. Midha, and D. J. Economou, “Alternating Fluxes of Positive and Negative Ions from an Ion-Ion Plasma," Appl. Phys. Lett., 78, 22-24 (2001).

  87. D. J. Economou, “Modeling and Simulation of Plasma Etching Reactors for Microelectronics,” Thin Solid Films, 365, 348-367 (2000).

  88. J. Feldsien, D. Kim, and D. J. Economou, "SiO2 Etching in Inductively Coupled Plasmas: Surface Chemistry and Two-Dimensional Simulations,” Thin Solid Films, 374, 311-325 (2000).

  89. V. Midha and D. J. Economou, "Spatiotemporal Evolution of a Pulsed Chlorine Discharge," Plasma Sources Sci. Technol., 9, 256-269 (2000).

  90. S. Panda, D. J. Economou, and M. Meyyappan, “Effect of Metastable Oxygen Molecules in High-Density Power Modulated Oxygen Discharges,” J. Appl Phys.,87, 8323-8333 (2000).

  91. I. Kaganovich, D.B. Ramamurthi, and D. J. Economou, “Self-Trapping of Negative Ions due to Electron Detachment in the Afterglow of Electronegative Gas Plasmas,” Appl. Phys. Lett., 76, 2844-2846 (2000).

  92. I. Kaganovich, D. J. Economou, B. N. Ramamurthi, and V. Midha, “Negative Ion Density Fronts During Ignition and Extinction of Plasmas in Electronegative Gases,” Phys. Rev. Lett., 84, 1918-1921 (2000).

  93. "Composition of Trench Sidewalls and Bottoms for SiO2-Masked Si(100) Etched in Cl2 Plasmas", K. H. A. Bogart and V. M. Donnelly, J. Appl. Phys., 87, 8351 (2000).

  94. "Diagnostic Studies of Aluminum Etching in an Inductively-Coupled Plasma System: Determination of Electron Temperatures and Connections to Plasma-Induced Damage", M. V. Malyshev, V. M Donnelly, S. W. Downey, J. I. Colonell, and N. Layadi, J. Vac. Sci. Technol. A. 18, 849 (2000).

  95. "Reduction of Plasma Induced Damage in an Inductively Coupled Plasma Using Pulsed Source Power", S. Samukawa, K. Noguchi, J. I. Colonell, K. H. A. Bogart, M. V. Malyshev, and V. M Donnelly, J. Vac. Sci. Technol. B, 18, 834 (2000).

  96. "Dynamics of Inductively-Coupled Pulsed Chlorine Plasmas in the Presence of Continuous Substrate Bias", M. V. Malyshev and V. M. Donnelly, Plasma Sources Sci. Technol. 9, 353 (2000).

  97. "Effects of Discharge Frequency in Plasma Etching and Ultrahigh Frequency Plasma Source for High-Performance Etching for ULSI", S. Samukawa, V. M. Donnelly, and M. V. Malyshev, Jpn. J. Appl. Phys., 39, 1583 (2000).

  98. "Diagnostics of Inductively Coupled Chlorine Plasmas: Measurement of Cl2+ and Cl+ Densities", M. V. Malyshev, N. C. M. Fuller, K. H. A. Bogart, V. M. Donnelly, and I. P. Herman, J. Appl. Phys. 88, 2246 (2000).

  99. "Diagnostics of Chlorine Inductively Coupled Plasmas: Measurement of Electron Temperatures and Electron Energy Distribution Functions", M. V. Malyshev and V. M Donnelly, J. Appl. Phys, 87, 1642 (2000).

  100. "Diagnostics of Inductively Coupled Chlorine Plasmas: Measurement of Cl2 and Cl Number Densities", M. V. Malyshev and V. M Donnelly, J. Appl. Phys. 88, 6207 (2000).

  101. "Diagnostics of Inductively Coupled Chlorine Plasmas: Measurements of the Neutral Gas Temperature", V. M Donnelly and M. V. Malyshev, Appl. Phys. Lett., 77, 2467 (2000).

  102. "Characterization of Transformer Coupled Oxygen Plasmas by Trace Rare Gases-Optical Emission Spectroscopy and Langmuir Probe Analysis", N.C.M. Fuller, M.V. Malyshev, V.M.Donnelly, and I. P. Herman, Plasma Sources Sci. Technol. 9, 116 (2000).

  103. S.-K. Nam, C. B. Shin, and D. J. Economou, "Two-dimensional plasma reactor simulation with self-consistent coupling of gas flow with plasma transport,” Materials Science in Semiconductor Processing,” 2, 271-279 (1999).

  104. C.-K. Kim, N. A. Kubota, and D. J. Economou, “Molecular Dynamics Simulation of Silicon Surface Smoothing by Low-Energy Argon Cluster Impact,” J. Appl. Phys., 86(12), 6758-6762 (1999).

  105. S. Panda, J. Kim, B. H. Weiller, D. J. Economou, and D. M. Hoffman, “Low Temperature Chemical Vapor Deposition of Titanium Nitride Films from Tetrakis(ethylmethylamido)titanium and ammonia,” Thin Solid Films, 357, 125-131 (1999).

  106. N. Gupta, V. Midha, V. Balakotaiah, and D. J. Economou, “Bifurcation Analysis of Thermal Runaway in Microwave Heating of Ceramics,” J. Electrochem. Soc., 146(2), 4659-4665 (1999).

  107. N. A. Kubota, and D. J. Economou, “A Molecular Dynamics Simulation of Ultrathin Oxide Films on Silicon: Growth by Thermal O Atoms and Sputtering by 100 eV Ar+ Ions,” IEEE Trans. Plasma Sci., 27(5), 1416-1425 (1999).

  108. * D. J. Economou, “Multiscale Modeling in Plasma Engineering and Parallels to Electrochemical Engineering,” in Tutorials in Electrochemical Engineering-Mathematical Modeling, Electrochemical Society Proceedings Volume, R. F. Savinell, editor, August 1999.

  109. N. A. Kubota, and D. J. Economou, “Molecular Dynamics Simulations of Ion-Induced Rearrangements of Ultrathin Oxide Films on Silicon,” IEEE Trans. Plasma Sci., 27, 106 (1999).

  110. D. J. Economou, N. A. Kubota, and R. S. Wise, “Plasmoid Formation and Multiple Steady States in a Low Pressure Inductively Coupled Electronegative Plasmas,” IEEE Trans. Plasma Sci., 27, 60 (1999).

  111. T. Panagopoulos and D. J. Economou, “Plasma Sheath Model and Ion Energy Distribution for All Radio Frequencies,”J. Appl. Phys., 85, 3435 (1999).

  112. D. J. Economou, “Plasma Reactor Engineering,” in Advances in Electrochemistry and Electrochemical Engineering, Vol. 6, p. 237, edited by R. C. Alkire and D. M. Kolb, Wiley-VCH (1999).

  113. D. J. Economou, T. L. Panagopoulos, and M. Meyyappan, "Examining Scale-Up and Computer Simulation in Tool Design for 300-mm wafer Processing," Micro, 16(7), 101-113 (1998).

  114. V. Midha and D. J. Economou, “A Two-Dimensional Model of Chemical Vapor Infiltration with Radio Frequency Heating II: Strategies to Achieve Complete Densification,” J. Electrochem. Soc., 145, 3569-3580 (1998).

  115. N. A. Kubota, D. J. Economou, and S. Plimpton, “Molecular Dynamics Simulations of Low Energy (25-200 eV) Argon Ion Interactions with Silicon Surfaces: Sputter Yields and Product Formation Pathways,” J. Appl. Phys., 83, 4055-4063 (1998).

  116. * V. Midha and D.J. Economou, “Effect of Geometry on CVI with RF Heating", Ceramic Engineering and Science Proceedings, 19(3-4), (1998).

  117. D. J. Economou, J. Feldsien, and R. S. Wise, “Transport and Reaction in Inductively Coupled Plasmas for Microelectronics,” in Electron Kinetics and Applications of Glow Discharges, edited by U. Kortshagen and L. D. Tsendin, NATO Advanced Research Workshop, Plenum (1998).

  118. 61. V. I. Kolobov and D. J. Economou, “Ion-Ion Plasmas in Weakly Collisional Discharges in Electronegative Gases,” Appl. Phys. Lett., 72, 656-658 (1998).

  119. D. P. Lymberopoulos, V. I. Kolobov, and D. J. Economou, “Fluid Simulation of a Pulsed-Power Inductively Coupled Argon Plasma,” J. Vac. Sci. Technol. A, 16, 564-571 (1998).

  120. V. Midha and D. J. Economou, “A Two-Dimensional Model of Chemical Vapor Infiltration with Radio Frequency Heating,” J. Electrochem. Soc., 144, 4062-4071 (1997).

  121. J. Johannes, T. Bartel, G. A. Hebner, J. Woodworth, and D. J. Economou, "Direct Simulation Monte Carlo of Inductively Coupled Plasma and Comparison with Experiments," J. Electrochem Soc., 144, 2448-2455 (1997).

  122. * V. Midha and D. J. Economou, “A Two-Dimensional Model of Chemical Vapor Infiltration with Radio Frequency Heating,” in Proceedings of the Fourteenth International Conference on Chemical Vapor Deposition and EUROCVD-11, Paris, France, edited by M. D. Allendorf and C. Bernard, The Electrochemical Society Proceedings Volume PV 97-25, pp. 528-535 (1997).

  123. Proceedings of the 2nd International Symposium on Control, Diagnostics, and Modeling in Semiconductor Manufacturing, M. Meyyappan, D. J. Economou, and S. W. Butler, eds., The Electrochemical Society Inc., Vol. 97-9 (1997).

  124. V. I. Kolobov and D. J. Economou, "Anomalous Skin Effect in Gas Discharge Plasmas," Plasma Sources Sci. & Technol., 6, R1-R17 (1997).

  125. V. I. Kolobov, D. P. Lymberopoulos, and D. J. Economou, "Electron Kinetics and Non-Joule Heating in Near Collisionless Inductively Coupled Plasmas," Physical Review E, 55, 3408 (1997).

  126. D. J. Economou, “Direct Simulation Monte Carlo (DSMC) of Low Pressure Plasma Reactors,” in Proceedings of the International Symposium on Plasma and Fluid Simulation for Materials Processing, edited by K. Nanbu, Vol. 10, pp. 83-90, published by the Institute of Fluid Science, Tohoku University, Sendai, Japan (1997).

  127. * J. Feldsien and D. J. Economou, “Parametric Investigation of Plasma Uniformity in a Dome-Shaped Inductively Coupled Plasma Reactor,” in Proceedings of the 2nd International Symposium on Control, Diagnostics, and Modeling in Semiconductor Manufacturing, M. Meyyappan, D. J. Economou, and S. W. Butler, eds., The Electrochemical Society Inc., Vol. 97-9, pp. 260-267 (1997).

  128. R. S. Wise, D. P. Lymberopoulos and D. J. Economou, “A TCAD Simulation Tool for Inductively Coupled Plasma Reactors and Comparison with Experiments,” in Proceedings of the 11th Plasma Processing Symposium, edited by G. S. Mathad, M. Meyyappan, and D. W. Hess, The Electrochemical Society, PV-96-12, 11-19 (1996).

  129. D. J. Economou and T. Bartel, “Direct Simulation Monte Carlo (DSMC) of Semiconductor Manufacturing Processes,” in Proceedings of the 11th Plasma Processing Symposium, edited by G. S. Mathad, M. Meyyappan, and D. W. Hess, The Electrochemical Society, PV-96-12, 70-82 (1996).

  130. J. Johannes, T. Bartel, D. J. Economou, G. Hebner, R. Wise, and J. Woodworth, "Direct Simulation Monte Carlo of Inductively Coupled Plasma and Comparison with Experiments," in Proceedings of the 11th Plasma Processing Symposium, edited by G. S. Mathad, M. Meyyappan, and D. W. Hess, The Electrochemical Society, PV-96-12, 20-38 (1996).

  131. D. J. Economou, D. M. Hoffman, S. P. Rangarajan, S. D. Athavale, J.-R. Liu, Z. Zheng, and W.-K. Chu, “Chemical Vapor Deposition of Aluminum and Gallium Nitride Thin Films from Metalorganic Precursors," in Proceedings of the Symposium on III-V Nitride Materials and Processes, edited by T. Moustakas and J. P. Dismukes, and S.J. Pearton, The Electrochemical Society Inc., Vol. 96-11, p. 69 (1996).

  132. S. Athavale and D. J. Economou, "Realization of Atomic Layer Etching (ALET) of Silicon," J. Vac. Sci. Technol. B, 14, 3702 (1996).

  133. R. Wise, D. Lymberopoulos and D. J. Economou, "Rapid Two-Dimensional Self-Consistent Simulation of Inductively Coupled Plasma and Comparison with Experiments," Appl. Phys. Lett., 68, 2499 (1996).

  134. D. Lymberopoulos, R. Wise, D. J. Economou, and T. Bartel "Ion Density and Temperature Distribution in an Inductively Coupled High Plasma Density Reactor," IEEE Trans. Plasma Sci., 24, 129 (1996).

  135. D. J. Economou and T. J. Bartel, "Direct Simulation Monte Carlo (DSMC) of Rarefied Gas Flow During Etching of Large Diameter (300 mm) Wafers," IEEE Trans. Plasma Sci., 24, 131 (1996).

  136. D. M. Hoffman, S. P. Rangarajan, S. D. Athavale, D. J. Economou, J.-R. Liu, Z. Zheng, and W.-K. Chu, “Chemical vapor deposition of aluminum and gallium nitride thin films from metalorganic precursors," J. Vac. Sci. Technol. A, 14, 306-311 (1996).

  137. J. Johannes, T. Bartel, D. Economou, D. Lymberopoulos and R. Wise, "Simulation Images from a Low Pressure Chlorine Plasma Reactor Using the Direct Simulation Monte Carlo Method," IEEE Trans. Plasma Sci., 24, 127 (1996).

  138. D. J. Economou, "Computational Modeling in Semiconductor Manufacturing," AIChE Journal (book review), 1996.

  139. D. J. Economou, "The Chemistry of Plasma Etching," in The Chemistry of Electronic Materials, H. B. Pogge, editor, pp. 251-322, Marcel Dekker, Inc., 1996.

  140. D. P. Lymberopoulos and D. J. Economou, “Two-Dimensional Self-Consistent Radio Frequency Plasma Simulations Relevant to the Gaseous Electronics Conference (GEC) Reference Cell," Journal of Research of the National Institute of Standards and Technology,” 100, 473-494 (1995).

  141. P. Jiang, D. J. Economou, and C. B. Shin, “Effect of Power Modulation on Radical Concentration and Uniformity in a Single-Wafer Plasma Reactor,” Plasma Chemistry Plasma Process., 15, 383-408 (1995).

  142. R. S. Wise, D. P. Lymberopoulos and D. J. Economou, “A Two-Region Model of a Radio Frequency Low-Pressure High-Density Glow Discharge," Plasma Sources Sci. Technol., 4, 317-331 (1995).

  143. D. P. Lymberopoulos and D. J. Economou, “Two-Dimensional Simulation of Polysilicon Etching with Chlorine in a High Density Plasma Reactor,” IEEE Trans. Plasma Sci., 23, 573-580 (1995).

  144. D. J. Economou, T. J. Bartel, R. S. Wise and D. P. Lymberopoulos, “Two-Dimensional Direct Simulation Monte Carlo (DSMC) of Reactive Ion and Neutral Flow in a High Density Plasma Reactor,” IEEE Trans. Plasma Sci., 23, 581-590 (1995).

  145. D. P. Lymberopoulos and D. J. Economou, “Spatiotemporal Electron Dynamics in Radio Frequency Glow Discharges,” J. Phys. D: Appl. Phys., 28, 727-737 (1995).

  146. D. M. Hoffman, S. P. Rangarajan, S. D. Athavale, D. J. Economou, J.-R. Liu, Z. Zheng, and W.-K. Chu, “Plasma enhanced chemical vapor deposition of silicon, germanium and tin nitride thin films from metal-organic precursors," J. Vac. Sci. Technol. A, 13, 820-825 (1995).

  147. S. D. Athavale and D. J. Economou, “Molecular Dynamics Simulation of Atomic Layer Etching (ALET) of Silicon," J. Vac. Sci. Technol. A, 13, 966-971 (1995).

  148. * D. P. Lymberopoulos R. Wise, and D. J. Economou, Modeling and Simulation of Two-Dimensional Reactive Plasma Flow in Inductively Coupled Reactors, in Proceedings of the 1st International Symposium on Control, Diagnostics, and Modeling in Semiconductor Manufacturing, M. Meyyappan, D. J. Economou, and S. W. Butler, eds., The Electrochemical Society Inc., Vol. 95-2, pp. 588-595 (1995).

  149. Proceedings of the 1st International Symposium on Control, Diagnostics, and Modeling in Semiconductor Manufacturing, M. Meyyappan, D. J. Economou, and S. W. Butler, eds., The Electrochemical Society Inc., Vol. 95-2 (1995).

  150. D. P. Lymberopoulos and D. J. Economou, Modeling and Simulation of Inductively Coupled High Density Plasma Sources, in Proceedings of the 10th Plasma Processing Symposium, edited by G. S. Mathad and D. W. Hess, The Electrochemical Society, Vol. 94-20, pp. 1-12 (1994).

  151. C. R. Koemtzopoulos, D. J. Economou, and R. Pollard, "Influence of Substrate Placement on Plasma-Assisted Chemical Vapor Deposition of Diamond," in The Synthesis and Processing of Electronic Materials, Topical Conference Preprints, AIChE Conference, San Francisco, CA, Nov. 1994.

  152. D. P. Lymberopoulos and D. J. Economou, "Modeling and Simulation of Glow Discharge Plasma Reactors," J. Vac. Sci. Technol. A, 12, 1229-1236 (1994).

  153. N. L. Bassett and D. J. Economou, “Effect of Cl2 Additions to an Argon Glow Discharge,” J. Appl. Phys., 75, 1931-1939 (1994).

  154. D. M. Hoffman, S. P. Rangarajan, S. D. Athavale, S. C. Deshmukh, D. J. Economou, J.-R. Liu, Z. Zheng, and W.-K. Chu, “Plasma Enhanced Chemical Vapor Deposition of Silicon Nitride Films from Metalorganic Precursors," J. Mater. Res., 12, 3019-3021 (1994).

  155. D. M. Hoffman, S. P. Rangarajan, S. D. Athavale, D. J. Economou, J.-R. Liu, Z. Zheng, and W.-K. Chu, “Plasma Enhanced Metalorganic Chemical Vapor Deposition of Germanium Nitride Thin Films,” Mater. Res. Soc. Symp. Proc., 335, 3-7 (1994).

  156. J. Morrel, D. J. Economou, and N. Amundson, "Chemical Vapor Infiltration of SiC with Volume Heating," J. Mater. Res., 8, 1057-1067 (1993).

  157. D. P. Lymberopoulos and D. J. Economou, "Fluid Simulations of Glow Discharges: Effect of Metastable Atoms in Ar," J. Appl. Phys., 73, 3668-3679 (1993).

  158. D. P. Lymberopoulos and D. J. Economou, "Fluid Simulations of Radio Frequency Glow Discharges: Two-Dimensional Argon Discharge Including Metastables," Appl. Phys. Lett., 63, 2478-2480 (1993).

  159. P. Jiang and D. J. Economou, "Temporal Evolution of the Electron Energy Distribution Function in Oxygen and Chlorine Gases under DC and AC Fields," J. Appl. Phys., 73, 8151-8160 (1993).

  160. C. R. Koemtzopoulos, D. J. Economou, and R. Pollard, "Hydrogen Dissociation in a Microwave Discharge for Diamond Deposition," Diamond and Related Materials, 2, 25-35 (1993).

  161. E. S. Aydil and D. J. Economou, "Modeling of Plasma Etching Reactors Including Wafer Heating Effects," J. Electrochem. Soc., 140, 1471-1481 (1993).

  162. S. Deshmukh and D. J. Economou, "Remote Plasma Etching Reactors: Modeling and Experiment," J. Vac. Sci. Technol. B, 11, 206-215 (1993).

  163. Q. Xiong, Y. Y. Xue, P. Hor, C. W. Chu, M. Davis, J. Wolfe, S. Deshmukh, and D. Economou, "Effect of pressure on the critical current density of YBa2Cu3O7-δ thin films," Physica C, 205, 307 (1993).

  164. D. J. Economou, "Developments in Wet Etching and Deposition for Pattern Delineation," in Trends in Electrochemistry, Council of Scientific Research Integration (1993).

  165. D. J. Economou and D. P. Lymberopoulos, "Self-Consistent Simulation of RF Glow Discharges Coupled with Neutral Transport and Reaction," in Proc. 3rd International Symp. on Process Phys. and Modeling in Semicond. Technol., G. R. Srinivasan, K. Taniguchi, and C. S. Murthy, eds., The Electrochemical Society Inc., 93-6 (1993).

  166. S. Deshmukh, S. Athavale and D. J. Economou, "Radical Beam Etching: Application to Patterning of YBa2Cu3O6+x High Tc Superconducting Thin Films," in Proc. of International Symp. on Highly Selective Dry Etching and Damage Control, G. S. Mathad and Y. Horiike, eds., The Electrochemical Society Inc., 93-21, 235 (1993).

  167. D. J. Economou, "Modeling Potential Distribution, Transport and Reaction in Gas Plasmas," in Proc. of the 2nd International Symp. on Electrochemical Processing of Tailored Materials," R. C. Alkire, N. Masuko, Y. Ito, D. R. Sadoway, and D. J. Economou, eds., The Electrochemical Society Inc., 93-12, 1 (1993).

  168. Proceedings of the 2nd International Symposium on Electrochemical Processing of Tailored Materials, R. C. Alkire, N. Masuko, Y. Ito, D. R. Sadoway, and D. J. Economou, eds., The Electrochemical Society Inc., Vol. 93-12 (1993).

  169. E. S. Aydil and D. J. Economou, "Modeling of Plasma Etching Reactors Including Wafer Heating Effects," in Proc. 9th Plasma Process. Symp., The Electrochemical Society Inc., edited by G. S. Mathad and D. W. Hess, 92-18, 22 (1992).

  170. S. Deshmukh and D. J. Economou, "Factors Affecting the Cl Atom Density in a Chlorine Discharge," J. Appl. Phys., 72, 4597-4607 (1992).

  171. J. Morrel, D. J. Economou, and N. Amundson, "Pulsed-Power Volume-Heating Chemical Vapor Infiltration," J. Mater. Res. 7, 2447-2457 (1992).

  172. The following two papers won the Young Author Best Paper Award by the Journal of the Electrochemical Society in 1992.
    E. Aydil and D. Economou, “Combined Theoretical and Experimental Investigations of Chlorine RF Glow Discharges. I: Theoretical,” J. Electrochem. Soc., 139, 1396-1406 (1992).

  173. E. Aydil and D. Economou, “Combined Theoretical and Experimental Investigations of Chlorine RF Glow Discharges. II: Experimental,” J. Electrochem. Soc., 139, 1406-1412 (1992).

  174. F. Fong, S. Deshmukh, M. Davis, D. Stumbo, J. Wolfe, and D. Economou, "Resolution Limits of Ion Milling for Fabricating Y1Ba2Cu3Ox Nanostructures," J. Appl. Phys., 71, 2461 (1992).

  175. J. Morrel, D. Economou and N. Amundson, "A Mathematical Model for Chemical Vapor Infiltration with Volume Heating," J. Electrochem. Soc., 139, 328-336 (1992).

  176. Y. J. Zhao, W. K. Chu, M. F. Davis, J. C. Wolfe, S. C. Deshmukh, D. J. Economou, and A. McGuire, "Radiation Damages and Flux Pinning in YBCO Thin Films," Physica C, 184, 144-148 (1991).

  177. Eray Aydil and D. Economou, “Multiple Steady-States in a Radio Frequency Chlorine Glow Discharge,” J. Appl. Phys., 69, 109-114 (1991).

  178. C. B. Shin and D. Economou, “Forced and Natural Convection Effects on the Shape Evolution of Cavities during Wet Chemical Etching,” J. Electrochem. Soc., 138, 527-538 (1991).

  179. S.-K. Park and D. Economou, “A Mathematical Model for Etching of Silicon Using Tetrafluoromethane in a Radial Flow Plasma Reactor," J. Electrochem. Soc., 138, 1499-1508 (1991).

  180. D. Economou, E. Aydil, and G. Barna, "In Situ Monitoring of Etching Uniformity in Plasma Reactors," Solid State Technology, 34, 107-111 (1991).

  181. M. Davis, J. Wosik, K. Foster, S. Deshmukh, H. Rampersad, S. Shah, P. Siesmen, D. Economou, and J. Wolfe, “Deposition of High Quality Y1Ba2Cu3Ox Thin Films over Large Areas by Pulsed Laser Ablation with Substrate Scanning," J. Appl. Phys., 69, 7182-7188 (1991).

  182. Ping Jiang and D. Economou, "Wet Etching of GaAs Using a Novel Rotating Cell Reactor," J. Electrochem. Soc., 138, L28-L29 (1991).

  183. Y. J. Zhao, W. K. Chu, D. K. Christen, E. C. Jones, M. F. Davis, J. C. Wolfe, S. C. Deshmukh, and D. J. Economou, "Linewidth Dependence of Critical Current Density in Y1Ba2Cu3Ox Thin Film Microbridges," Appl. Phys. Lett., 59, 1129-1131 (1991).

  184. S.-K. Park and D. Economou, “Numerical Simulation of a Single-Wafer Isothermal Plasma Etching Reactor,” J. Electrochem. Soc., 137, 2624-2634 (1990).

  185. C. B. Shin and D. Economou, “Mass Transfer by Natural and Forced Convection in Open Cavities,” Int. J. Heat Mass Transfer, 33, 2191-2205 (1990).

  186. S.-K. Park and D. Economou, “Analysis of a Pulsed-Plasma Chemical Vapor Deposition Reactor with Recycle,” J. Electrochem. Soc., 137, 2103-2116 (1990).

  187. S.-K. Park and D. Economou, “Parametric Studies of a Radio Frequency Glow Discharge Using a Continuum Model," J. Appl. Phys., 68, 4888-4890 (1990).

  188. E. Aydil and D. Economou, "Experimental and Modeling Studies of Chlorine RF Glow Discharges," in Proc. 8th Plasma Process. Symp., The Electrochemical Society Inc., edited by G. S. Mathad and D. W. Hess, 90-14, 77 (1990).

  189. D. Economou and S.-K. Park, "Modeling and Analysis of Pulsed Plasma CVD and Etching Reactors," in Proc. 8th Plasma Process. Symp., The Electrochemical Society Inc., edited by G. S. Mathad and D. W. Hess, 90-14, 185 (1990).

  190. G. Barna, J. Spatafora, E. Aydil, and D. Economou, "Spectroscopic Measurement of Etchant Concentration Profiles in a Parallel Plate Plasma Reactor," in Proceedings of the Society of Manufacturing Engineers, MS90-476, pp. 1-12, 1990.

  191. J. Wosik, T. Robin, M. Davis, J. C. Wolfe, K. Foster, S. Deshmukh, A. Bensaoula, R. Sega, D. Economou, and A. Ignatiev, "Dependence of Millimeter Wave Surface Resistance on the Deposition Parameters of Laser Ablated Y1Ba2Cu3Ox Thin Films," p. 539 in Proceedings of the 2nd Conference on the Science and Technology of Thin Film Superconductors, Denver, Co, 1990.

  192. S.-K. Park and D. Economou, “Analysis of Low Pressure RF Glow Discharges Using a Continuum Model," J. Appl. Phys., 68, 3904-3915 (1990).

  193. D. Economou, S.-K. Park, and G. Williams, “Uniformity of Etching in Parallel Plate Plasma Reactors,” J. Electrochem. Soc., 136, 188-198 (1989).

  194. C. B. Shin and D. Economou, “Effect of Transport and Reaction on the Shape Evolution of Cavities during Wet Chemical Etching,” J. Electrochem. Soc., 136, 1997-2004 (1989).

  195. S.-K. Park and D. Economou, “A Mathematical Model for a Plasma-Assisted Downstream Etching Reactor,” J. Appl. Phys., 66, 3256-3267 (1989).

  196. D. Economou and R. Alkire, “Effect of Potential Field on Ion Deflection and Shape Evolution of Trenches during Plasma-Assisted Etching,” J. Electrochem. Soc., 135, 941-949 (1988).

  197. D. Economou, D. Evans, and R. Alkire, “A Time-Average Model of the RF Plasma Sheath,” J. Electrochem. Soc., 135, 756-763 (1988).

  198. D. Economou, S.-K. Park, and G. Williams, "Parallel Plate Plasma Etching Reactor Modeling: Uniformity of Etching," in Proc. of the 7th Plasma Process. Symp., The Electrochemical Society Inc., edited by G. S. Mathad, G. C. Schwartz, and D. W. Hess, 88-22, 17 (1988).

  199. D. Economou and R. Alkire, “A Mathematical Model for a Parallel Plate Plasma Etching Reactor,” J. Electrochem. Soc., 135, 2786-2794 (1988).

  200. D. Economou and R. Alkire, “Two-Phase Mass Transfer in Channel Electrolyzers with Gas-Liquid Flow,” J. Electrochem. Soc., 132, 601-608 (1985).

  201. R. Alkire and D. Economou, “Transient Behavior during Film Removal in Diffusion-Controlled Plasma Etching,” J. Electrochem. Soc., 132, 648-656 (1985).

  202. D. Economou and R. Alkire, in Proceedings of the Advances in the Chlor-Alkali and Chlorate Industry, The Electrochemical Society Inc., 1985.

  203. D. Economou and R. Alkire, in Proceedings of the 5th Symposium on Plasma Processing, The Electrochemical Society Inc., 1985.

  204. C. Philippopoulos, D. Economou, C. Economou, and J. Marangozis, “Norbornadiene-Quadricyclane System in the Photochemical Conversion and Storage of Solar Energy,” Ind. Eng. Chem. Prod. Res. Dev., 22, 627 (1983).